2N7002DW optimos ? small-signal-transistor features ? dual n-channel ? enhancement mode ? logic level ? avalanche rated ? fast switching ? qualified according to aec q101 ? 100% lead-free; rohs compliant parameter 1) symbol conditions unit continuous drain current i d t a =25 c 0.30 a t a =70 c 0.24 pulsed drain current i d,pulse t a =25 c 1.2 avalanche energy, single pulse e as i d =0.3 a, r gs =25 ? 1.3 mj reverse diode d v /d t d v /d t i d =0.3 a, v ds =48 v, d i /d t =200 a/s, t j,max =150 c 6 kv/s gate source voltage v gs 20 v esd class jesd22-a114 (hbm) class 0 (<250v) power dissipation p tot t a =25 c 0.5 w operating and storage temperature t j , t stg -55 ... 150 c iec climatic category; din iec 68-1 55/150/56 1) remark: one of both transistors in operation. value pg-sot363 v ds 60 v r ds(on),max v gs =10 v 3 ? v gs =4.5 v 4 i d 0.3 a product summary 1 2 3 4 5 6 type package tape and reel information marking lead free packing 2N7002DW pg-sot363 l6327: 3000 pcs/reel x8s yes non dry rev.2.2 page 1 2010-03-25
2N7002DW parameter symbol conditions unit min. typ. max. thermal characteristics thermal resistance, junction - minimal footprint 2) r thja - - 250 k/w electrical characteristics, at t j =25 c, unless otherwise specified static characteristics drain-source breakdown voltage v (br)dss v gs = 0 v, i d =250 a 60 - - v gate threshold voltage v gs(th) v ds =v gs , i d =250 a 1.5 2.1 2.5 drain-source leakage current i d (off) v ds =60 v, v gs =-10 v, t j =25 c - - 0.1 a v ds =60 v, v gs =0 v, t j =150 c --5 gate-source leakage current i gss v gs =20 v, v ds =0 v - 1 10 na drain-source on-state resistance r ds(on) v gs =4.5 v, i d =0.25 a - 2.0 4 ? v gs =10 v, i d =0.5 a - 1.6 3 transconductance g fs | v ds |>2| i d | r ds(on)max , i d =0.24 a 0.2 0.36 - s values 2) perfomed on a 40x40mm 2 fr4 pcb with both sided cu sense-force traces, each 1mm wide, 70 m thick and 20mm long. rev.2.2 page 2 2010-03-25
2N7002DW parameter symbol conditions unit min. typ. max. dynamic characteristics input capacitance c iss -1320pf output capacitance c oss - 4.1 6 reverse transfer capacitance c rss - 2.0 3 turn-on delay time t d(on) - 3.0 4.5 ns rise time t r - 3.3 5 turn-off delay time t d(off) - 5.5 9 fall time t f - 3.1 5 gate charge characteristics gate to source charge q gs - 0.05 0.1 nc gate to drain charge q gd - 0.2 0.4 gate charge total q g - 0.4 0.6 gate plateau voltage v plateau - 4.0 - v reverse diode diode continous forward current i s - - 0.3 a diode pulse current i s,pulse - - 1.2 diode forward voltage v sd v gs =0 v, i f =0.5 a, t j =25 c - 0.96 1.2 v reverse recovery time t rr - 8.5 13 ns reverse recovery charge q rr - 2.4 4 nc v r =30 v, i f =0.5 a, d i f /d t =100 a/s t a =25 c values v gs =0 v, v ds =25 v, f =1 mhz v dd =30 v, v gs =10 v, i d =0.5 a, r g =6 ? v dd =48 v, i d =0.5 a, v gs =0 to 10 v rev.2.2 page 3 2010-03-25
2N7002DW 1 power dissipation 2 drain current p tot =f( t a ) i d =f( t a ); v gs 10 v 3 safe operating area 4 max. transient thermal impedance i d =f( v ds ); t a =25 c; d =0 z thja =f( t p ) parameter: t p parameter: d = t p / t 1 s 10 s 100 s 1 ms 10 ms dc 10 1 10 0 10 -1 10 -2 10 -3 1 10 100 v ds [v] i d [a] limited by on-state resistance single pulse 0.01 0.02 0.05 0.1 0.2 0.5 10 3 10 2 10 1 10 0 10 -1 10 -2 10 -3 10 -4 10 -5 10 3 10 2 10 1 10 0 t p [s] z thja [k/w] 0 0.1 0.2 0.3 0.4 0.5 0 40 80 120 160 t a [c] p tot [w] 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0 40 80 120 160 t a [c] i d [a] rev.2.2 page 4 2010-03-25
2N7002DW 5 typ. output characteristics 6 typ. drain-source on resistance i d =f( v ds ); t j =25 c r ds(on) =f( i d ); t j =25 c parameter: v gs parameter: v gs 7 typ. transfer characteristics 8 typ. forward transconductance i d =f( v gs ); | v ds |>2| i d | r ds(on)max g fs =f( i d ); t j =25 c 2.9 v 3.2 v 3.5 v 4 v 4.5 v 5 v 7 v 10 v 0 1 2 3 4 5 6 0 0.1 0.2 0.3 0.4 0.5 i d [a] r ds(on) [ ? ] 0 0.1 0.2 0.3 0.4 0.5 0.6 012345 v gs [v] i d [a] 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.45 0.5 0.00 0.10 0.20 0.30 0.40 i d [a] g fs [s] 2.9 v 3.2 v 3.5 v 4 v 4.5 v 5 v 7 v 10 v 0 0.1 0.2 0.3 0.4 0.5 0.6 012345 v ds [v] i d [a] rev.2.2 page 5 2010-03-25
2N7002DW 9 drain-source on-state resistance 10 typ. gate threshold voltage r ds(on) =f( t j ); i d =0.3 a; v gs =10 v v gs(th) =f( t j ); v ds =v gs ; i d =250 a parameter: i d 11 typ. capacitances 12 forward characteristics of reverse diode c =f( v ds ); v gs =0 v; f =1 mhz; t j =25c i f =f( v sd ) parameter: t j typ 98 % 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -60 -20 20 60 100 140 t j [c] r ds(on) [ ? ] typ 98 % 2 % 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 -60 -20 20 60 100 140 t j [c] v gs(th) [v] ciss coss crss 10 2 10 1 10 0 0102030 v ds [v] c [pf] 25 c 150 c 25 c, 98% 150 c, 98% 10 0 10 -1 10 -2 10 -3 0 0.4 0.8 1.2 1.6 v sd [v] i f [a] rev.2.2 page 6 2010-03-25
2N7002DW 13avalanche characteristics 14 typ. gate charge i as =f(t av ); r gs =25 ? v gs =f( q gate ); i d =0.5 a pulsed parameter: t j(start) parameter: v dd 15 drain-source breakdown voltage v br(dss) =f( t j ); i d =250 a 50 55 60 65 70 -40 0 40 80 120 160 t j [c] v br(dss) [v] 12 v 30 v 48 v 0 1 2 3 4 5 6 7 8 9 10 0 0.1 0.2 0.3 0.4 0.5 q gate [nc] v gs [v] 25 c 100 c 125 c 10 3 10 2 10 1 10 0 10 0 10 -1 10 -2 10 -3 t av [s] i av [a] rev.2.2 page 7 2010-03-25
2N7002DW sot363 package outline: footprint: packing: rev.2.2 page 8 2010-03-25
2N7002DW published by infineon technologies ag 81726 munich, germany ? 2008 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered. rev.2.2 page 9 2010-03-25
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